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Home > chinese-english > "solder balling" in English

English translation for "solder balling"

锡球

Related Translations:
dip soldering:  沉浸钎焊浸入焊接浸渍软钎焊软浸焊
soldering ladle:  焊勺焊锡杓
soldering bushing:  焊接轴衬
soldered tube:  锡焊管
soldering roll:  焊锡辊
solder perform:  预成型锡料
soldering point:  焊接点
wiping solder:  擦拭焊料钎焊焊料锡铅焊料
hard solder:  硬焊料硬焊条硬焊锡硬钎料
solder fusing:  焊料熔化
Example Sentences:
1.Screen printing technology for solder ball flip chip for smt
倒装芯片及晶圆和基底凸起的网版印刷技术一
2.So it will result in rigidity skin & block and solder balls etc
产生的后果是:锡膏出现硬皮、硬块、难熔并产生大量锡球等。
3.Its development is based upon the solution of the reliability of solder ball , which is one of the key problems
而焊点可靠性问题是发展bga csp技术需解决的关键问题之一。
4.This could cause a variety of solder defects , ranging from solder balling to non - wetting to damaged devices to voiding to charred residues
这样会产生许多焊接缺陷,诸如锡球、润湿不良、破坏元器件、空洞、碳化等。
5.Often confused with solder balling , solder beading is a defect recognized by one or a few larger balls , generally located around chip caps and resistors
锡珠经常会和锡球混淆,锡珠一个或几个大的球,通常会位于小电容或电阻旁边。
6.Since solder balls do oxidize quickly and builds an oxide coat that reduces the soldering characteristic of the ball , the chips should be vacuum sealed shortly after the reball process
因为很容易氧化并且形成一个氧化层覆盖会降低锡球的焊接特性,所以在重新植球加工后应尽快真空封装。
7.It is proved that thermal fatigue is the main cause of the invalidity of the package . therefore , it is significant to research the reliability of solder ball under the thermal cycle
实践证明热作用是芯片封装组件失效破坏的主导因素,因此热循环条件下的焊点可靠性研究有着非常重要的意义。
8.In the five key factors of solder ball alloy , solder paste alloy , peak temperature , the time above liquidus and soldering environment , the fore four factors are more important than soldering environment to the solder joints reliability
在焊球合金、焊料合金、峰值温度、液相线以上时间和焊接环境五个关键因素中,前四项对焊点可靠性比较重要,焊接环境对焊点可靠性的影响不很显著。
9.In this paper , bga / csp is simulated and analyzed as implemented in the ansys finite element simulation software tool to evaluate the affect on its reliability ; the constitutive model of the solder ball is constructed tentatively to find a better description for the solder ball
为此,本文基于大型商用有限元软件ansys ,对bga csp形式的封装进行模拟,并在此基础上对多种情况进行对比分析,以此来评价各种因素对其可靠性的影响,从而来提高该封装的可靠性。
10.Zhang liji ( material physics and chemistry ) directed by professor xie xiaoming this paper is intended to solve problems for those who are designing , using pbgas . failure mechanism , as well as cycles to failure of two groups of pbga samples ( with / without underfill ) for thermal cycling conditions in the range of - 40 ~ 125 , were presented . the experiment shows that solder ball in the samples without underfill cracked after 500 times cycle , no crack was found in the underfilled samples even after 2700 cycles
通过一系列的实验,得到以下实验结果: ?在本论文设定的温度循环条件下,未充胶pbga样品的热疲劳品寿命在500周左右,充胶样品的焊点寿命高于2700周; ?对于未充胶器件,中心距( dnp )是决定焊点应力、应变大小的最主要因素,裂纹总是从中心距较大处萌生并向中心处扩展; ?温度循环的过程中焊盘附近焊料组织明显粗化。
Similar Words:
"solder - breach" English translation, "solder acid" English translation, "solder added" English translation, "solder alloy" English translation, "solder ball" English translation, "solder balls" English translation, "solder bar" English translation, "solder bars" English translation, "solder bath" English translation, "solder bead" English translation